SHIKUES Solution Appears at the 2022 Asia Charging Exhibition (ACE) to help the experience of fast charging




At the same time, the GaN HEMT integrated IC minimizes the adapter, reduces external components by 15%, and reduces the PCB size by 30%, solving the four core problems of customers:
- Integrate passive component placement system to reduce parts cost
- Increase the switching frequency of high-voltage switches by 1~5 times, taking into account EMI and reducing switching losses.
- The SMD QFN 8X8 package is used to expose the Lead Frame. After the installation, the exposed Exposed Pad is attached to the circuit board to achieve the purpose of heat dissipation.
- Integration of driver stage, controller and HEMT, easy to use and optimize performance

